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Hoco DT2 smart projector(720P Android version)(EU)
- Resolution: HD (1280 x 720 pixels)
- Display Technology: LCD
- Operating System: Android OS for streaming and app support;
- Projection Size: 30–100 inches;
- Brightness: 200 ANSI Lumens;
- Connectivity: Wi-Fi, HDMI, USB, 3.5mm audio jack
- Lamp Life: Up to 30,000 hours
- Color: Gray White
- Warranty: 6 Months
Rs.39,825.00 Rs.43,125.00 or 3 X Rs.13,275.00 with
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Hoco DT2 smart projector(720P Android version)(EU)
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- Manual Focus: Adjust the focus manually for clear projection images.
- G/2.4 Dual-band WiFi: Supports receiving signals from two frequencies, ensuring faster and more stable transmission.
- High-Definition Quality: 1280*720 native resolution with 90 ANSI lumens brightness, ideal for dark environments, projecting from 20 to 200 inches.
- Bluetooth 5.0: Supports Bluetooth audio transmission, can be used as a standalone stereo speaker or paired with external Bluetooth speakers/headphones, enhancing audio effects.
Vendor Information
- Store Name: BuyMore Computer
- Vendor: BuyMore Computer
-
Address:
No:5/1
Colombo Road
Polgahawela
60300 - No ratings found yet!
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Processors
AMD RYZEN 9 9900X PROCESSOR 100-100000662WOZ
- The world’s best gaming desktop processor that can deliver ultra-fast 100+ FPS performance in the world’s most popular games
- 12 Cores and 24 processing threads, based on AMD “Zen 5” architecture
- 5.6 GHz Max Boost, unlocked for overclocking, 76 MB cache, DDR5-5600 support
- For the state-of-the-art Socket AM5 platform, can support PCIe 5.0 on select motherboards
- Warranty: 2 Years
SKU: n/a -
Gaming Casing
NZXT H7 FLOW BLACK & WHITE ATX MID TOWER CASE CM-H71FG-01
Key Specs
- Motherboard Support:Mini-ITX, Micro-ATX, ATX
- Enclosure Type:Mid-Tower
Dimensions
- Height:505mm (With Feet)
- Width:230mm
- Depth:480mm
Compatibility & Clearance
- Max CPU Cooler Clearance:Up to 185mm
- Max GPU Clearance:Up to 400mm
- Front Radiator Clearance:60mm
- Top Radiator Clearance:30mm
- Cable Management:18-22mm
SKU: n/a
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Heatsink Compounds (Small)
- Purpose: Improve thermal conductivity between a heat source (e.g., CPU) and a heatsink.
- Form: Typically a thermal paste or grease.
- Benefits: Reduces heat build-up, prevents overheating, and improves device performance.
- Application: Apply a thin layer to the heat source before attaching the heatsink.
- Types: Available in various thermal conductivities and viscosities to suit different needs.
SKU: BM57919
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