Thermaltake CL-W007-PL 12BL-A Water 3.0 Ultimate Cooler Fan
- CL-W007-PL12BL-A
- Top of the line liquid cooler, equipped with power and performance. No Refills Needed.
- 360mm Radiator Doubles the Cooling Surface.
- Universal Socket Compatibility
Rs.23,350.00

- Brand: Thermaltake
- Model: CL-W007-PL12BL-A
- Type: Liquid Cooling System
- Block Compatibility: Intel LGA 2066 / 2011-3 / 2011 / 1366 / 1156 / 1155 / 1151 / 1150 , AMD Socket sTR4 / AM4 / AM3+ / AM3 / AM2+ / AM2 / FM2 / FM1
- Block Material: Copper
- Radiator Dim.: 393x 120 x 27 mm
- Radiator Material: Aluminum
- Fan Size: 3 Fan Slots (120mm)
- Tube Dim: Length 326 mm
- Tube Material: Rubber
Vendor Information
- Store Name: BuyMore Computer
- Vendor: BuyMore Computer
-
Address:
No:5/1
Colombo Road
Polgahawela
60300 - No ratings found yet!
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DAHUA DH-PFS4226-24GT-360 24 PORT PoE GIGABIT MANAGED SWITCH (2y)
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- > Layer 2 network management PoE switch
- > Support IEEE802.3af, IEEE802.3at standard
- > Support Hi-PoE 60W
- > Network Redundancy: STP/RSTP/MSTP
- > Support IPv4/IPv6, and DHCP
- > Network management based on SNMP
- > Configuration: Web, Telnet, CLI Command
- > QoS (IEEE802.1p/1Q), CoS/ToS to Increase Determinism
- > Enhanced Network Security with IEEE802.1X, SNMP v1/v2c/v3, HTTPS, and SSH/SSL
- > Large data cache(4M), real-time transmission
- > MAC auto study and aging, MAC address list capacity is 8K
- > EMC high protection design
2 Years Warranty
SKU: n/a -
Gaming Casing
NZXT H5 FLOW RGB WHITE ATX MID TOWER CASE CC-H51FW-R1
- Motherboard Support: Mini-ITX, Micro-ATX, ATX
- Model Number: CC-H51FW-R1
- Enclosure Type: Mid-Tower
- Case Material (White):SGCC Steel, Ultra-clear Tempered Glass
- Dimensions
- Height (With Feet):464mm
- Height (Without Feet):448mm
- Width:227mm
- Depth:446mm
- Weight:7.36 kg
- Max CPU Cooler Clearance:Up to 165mm
- Max GPU Clearance:Up to 365mm
- Front Radiator Clearance:45mm
- Cable Management:Up to 23mm
- PSU Clearance:Up to 185mm
SKU: n/a -
Devices & Accessories, Other Accessories, Others
Heatsink Compounds (Small)
- Purpose: Improve thermal conductivity between a heat source (e.g., CPU) and a heatsink.
- Form: Typically a thermal paste or grease.
- Benefits: Reduces heat build-up, prevents overheating, and improves device performance.
- Application: Apply a thin layer to the heat source before attaching the heatsink.
- Types: Available in various thermal conductivities and viscosities to suit different needs.
SKU: BM57919
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